Great examples and solved problems
Many, many practical problems described and solved in detail concerning packaging, PCB layout, housings, forced and non-forced air cooling. Great diagrams and tables of materials, given in both metric and English. Excellent book for the practical engineer to understand methods to cool PCB components.
Missing a lot for electronic packaging engineers
As a mechanical engineer who designs packaging for electronic equipment (telecommunications systems) I am rather disappointed in this book. There are basically two chapters that are useful while the rest are intended for aerospace applications. Fine, aerospace is a "sexier" application; but with the large number of engineers (ever growing) now looking at trying to keep 15W ASICs cool while avoiding EMC issues and/or manufacturing problems this book misses the boat.Anyone who has taken the TTI course (Dick Leatherman) or one of the other professional institutes around North America won't get anything from this textbook since it simply captures what's in your notes. For everyone else just wondering about this book - it isn't worth the money. The negatives: - the units (US imperial) are only useful in the US. The rest of the engineering world intelligently uses SI... - only two sections that are applicable to packaging engineering or other non-aerospace. - outdated technology. - no details on design fundamentals of cooling units (fans, blowers) - only two references to acoustic noise in the entire book! This is inexcusable for electronic equipment! - no discussion of integrating EMC solutions with thermal solutions. Not recommended unless you like shelfware...
This is THE book for thermal calcs for electronic packaging.
Lots of examples which apply theory to practical thermal problems in electronic packaging.
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